Title:
CAVITY FORMING METHOD IN METAL PLATE
Document Type and Number:
Japanese Patent JP2002326117
Kind Code:
A
Abstract:
To reduce stress and stress concentration in a process of forming a cavity in a metal plate, especially in a process of cutting a projecting part.
In this method, a recessed part 2 is formed from one surface 10a of the metal plate 10 by press forming by a press, and a projecting part 3 projected on the other surface side 10b of the metal plate 10 due to the formation of the recessed part 2 is cut by a cutting tool, thereby forming on the bottom surface a cavity having a bottom thinner than that of the metal plate 10. The projecting part 3 is cut from both sides by a pair of cutting tools 13 and 14 of which cutting directions are different and face to each other.
Inventors:
MIYAHARA HIDEYUKI
Application Number:
JP2001128475A
Publication Date:
November 12, 2002
Filing Date:
April 25, 2001
Export Citation:
Assignee:
NAKAMURA SEISAKUSHO KK
International Classes:
B23D1/14; B21D22/04; B23P13/04; B81C99/00; H01L23/36; (IPC1-7): B23D1/14; B23P13/04; B81C5/00
Domestic Patent References:
JP2000323607A | 2000-11-24 | |||
JP2000033429A | 2000-02-02 | |||
JP2000042819A | 2000-02-15 | |||
JP2000091479A | 2000-03-31 |
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