Title:
CEILING FILM CONSTRUCTION METHOD
Document Type and Number:
Japanese Patent JP2018071263
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To shorten the construction period and reduce the cost by easing laying of the ceiling film along the ceiling foundation material without scaffolding.SOLUTION: A ceiling film construction method for laying flexible band-like ceiling film 8 on a ceiling undercover material 5, in a state where linear bodies 16 are attached to both side portions of the ceiling film 8, the ceiling film 8 wound as the taken-up roll is placed on the floor, and both side portions 8a of the ceiling film 8 fed out from the winding roll are supplied to one end side of a pair of support rails 15 constituting the ceiling substrate 5, and supplied leading end portion of the ceiling film 8 is drawn out to the other end side along both support rails 15 and laid.SELECTED DRAWING: Figure 2
Inventors:
AMAGUMO SHINICHI
YOSHIKAWA ATSUSHI
YOSHIDA YUKIMASA
SHIRAISHI HIROSHI
KODERA NORIHIKO
KIMATA EIJI
YOSHIKAWA ATSUSHI
YOSHIDA YUKIMASA
SHIRAISHI HIROSHI
KODERA NORIHIKO
KIMATA EIJI
Application Number:
JP2016214826A
Publication Date:
May 10, 2018
Filing Date:
November 02, 2016
Export Citation:
Assignee:
TAKENAKA KOMUTEN CO
International Classes:
E04B9/22
Attorney, Agent or Firm:
Masahiro Miyaji