Title:
超硬合金接合体及びその製造方法
Document Type and Number:
Japanese Patent JP5513865
Kind Code:
B2
Inventors:
Hiroki Takahashi
Application Number:
JP2009279604A
Publication Date:
June 04, 2014
Filing Date:
December 09, 2009
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
B23K20/00; B22F7/06; B23K20/16; B23K20/233; B23K35/30; B28B3/26; C22C29/08
Domestic Patent References:
JP2006021211A | ||||
JP2001321805A | ||||
JP2000326318A | ||||
JP2009184237A | ||||
JP2006320951A | ||||
JP2006297474A |
Attorney, Agent or Firm:
Ippei Watanabe
Koji Kikawa
Chongqing Sugano
Hiroyuki Sato
Shigeru Koike
Koji Kikawa
Chongqing Sugano
Hiroyuki Sato
Shigeru Koike