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Title:
CENTERLESS GRINDING DEVICE AND GRINDING STATE MONITORING METHOD OF WORKPIECE
Document Type and Number:
Japanese Patent JP2019063891
Kind Code:
A
Abstract:
To provide a centerless grinding device or the like which measures a load acting on a workpiece, simultaneously monitors two kinds of items of the load and a vibration frequency, and can be properly adapted to a grinding state of the workpiece.SOLUTION: When an adjustment wheel 1 rotates clockwise around an axial line O, a grinding wheel 2 rotates clockwise around an axial line O, and a workpiece W is notched while rotating anticlockwise around an axial line O, operation positions of a load acting on a blade 4 at an arbitrary time, or a load acting on the workpiece which is supported by the blade, and a load of the blade are measured by a control device 20 following correlation relationship information which is held at a storage device 21 at a storage time on the basis of outputs of a first stress sensor Sand a second stress sensor S. When a component of a designated frequency which is extracted by frequency-analyzing a time series of the loads exceeds a threshold, designation processing for setting the component of the designated frequency to the threshold or smaller is performed.SELECTED DRAWING: Figure 1

Inventors:
SAKAE MOHEE
KOBAYASHI SATOSHI
TAKEDA KATSUYUKI
Application Number:
JP2017189045A
Publication Date:
April 25, 2019
Filing Date:
September 28, 2017
Export Citation:
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Assignee:
MICRON MACHINERY
International Classes:
B24B5/18; B24B5/307; B24B49/10; B24B49/16; B24B53/053
Attorney, Agent or Firm:
Creation International Patent Office