Title:
センターレス研削法
Document Type and Number:
Japanese Patent JP2008510632
Kind Code:
A
Abstract:
Organic bonded abrasive tools, having controlled microstructures, comprise a relatively low volume percentage of abrasive grain and a relatively low hardness grade, but are characterized by the excellent mechanical strength and efficient grinding performance of much harder grade, lower porosity tools, especially in versatile grinding processes, such as centerless grinding. A method for centerless grinding with these tools is provided. Methods for making the abrasive tools utilizing agglomerated abrasive grain are described.
Inventors:
Bonner, Anne M.
Lambert, Edward Elle.
Bigent, Bruce E.
Bright, eric
Lambert, Edward Elle.
Bigent, Bruce E.
Bright, eric
Application Number:
JP2007529906A
Publication Date:
April 10, 2008
Filing Date:
August 11, 2005
Export Citation:
Assignee:
Saint-Gobain Abrasives, Incorporated
International Classes:
B24B5/37; B24D3/00; B24B1/00; B24B5/04; B24B5/18; B24B5/36; B24B41/06; B24D3/02; B24D3/18; B24D3/26; B24D3/28; B24D3/32; B24D18/00; C09K3/14
Domestic Patent References:
| JP2003532550A | 2003-11-05 | |||
| JPH01216774A | 1989-08-30 | |||
| JPH01183370A | 1989-07-21 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Hiroshi Kamematsu
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Hiroshi Kamematsu