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Title:
CENTERLESS GRINDING WHEEL AND REGENERATING METHOD AND GRINDING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2001038640
Kind Code:
A
Abstract:

To delay a speed of forming a step difference between a cemented carbide abrasive grain layer and a sticking grinding wheel layer by sticking a grinding wheel including microcrystalline sintered alumina abrasive grains to one or both side surfaces of a centerless grinding wheel body, and binding this by a vitrified binder.

A centerless grinding wheel body 10 is composed of a cemented carbide abrasive grain layer, a sticking grinding wheel 11 is a grinding wheel including microcrystalline sintered alumina abrasive grains, and the thickness is within a range of 1/2 to 2/1 of a grinding object 13. Here, capacity of the microcrystalline sintered alumina abrasive grains occupies 10 to 100 volume % of the whole abrasive grains, and the grain size (a F value) of the microcrystalline sintered alumina abrasive grains according to stipulations of JIS R 6001 is the grain size within a range of ± three stages by centering the grain size of of the average particle size closest to the average particle size of the grain size according to stipulations of JIS B 4130 of cemented carbide abrasive grains, and a binding degree according to stipulations of JIS R 6210 is within a range of J to P.


Inventors:
MURAI MASAMITSU
Application Number:
JP21429499A
Publication Date:
February 13, 2001
Filing Date:
July 28, 1999
Export Citation:
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Assignee:
KURENOOTON KK
International Classes:
B24B5/18; B24D3/00; B24D3/14; B24D5/00; B24D5/14; (IPC1-7): B24D5/14; B24D3/00; B24D3/14; B24D5/00
Attorney, Agent or Firm:
Takashi Ishida (4 others)