Title:
CERAMIC CIRCUIT BOARD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3449683
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To inexpensively provide a ceramic circuit board which is superior in heat dissipating properties and high in reliability.
SOLUTION: A ceramics board 2 is provided with a circuit 1 or a circuit metal layer on its surface, and a silicon carbide porous body is arranged bearing against the backside of the ceramics board 2, in which a metal whose main component is aluminum is cast into a ceramics circuit board excluding the circuit 1 or a part of the circuit metal layer. The silicon carbide porous body is impregnated with a metal whose main component is aluminum to provide the ceramics circuit board and a manufacturing method thereof.
Inventors:
Ryuichi Terasaki
Masaaki Obata
Hideki Hirotsuru
Masaaki Obata
Hideki Hirotsuru
Application Number:
JP33026197A
Publication Date:
September 22, 2003
Filing Date:
December 01, 1997
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
International Classes:
B22D19/00; C22C1/10; C22C21/00; H01L23/12; H01L23/36; H05K1/02; H05K1/03; (IPC1-7): H01L23/12; H01L23/36
Domestic Patent References:
| JP8191120A | ||||
| JP8306856A | ||||
| JP61222668A |