Title:
CERAMIC CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP3921383
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a high-reliability ceramic circuit board which restrains heat from being generated when a current is concentrated in junction parts of a metal pillar to metal circuit boards, in the ceramic wiring board in which the metal circuit boards on both the surface and the rear surface are electrically connected by the metal pillar inside a through hole in a ceramic board.
SOLUTION: The ceramic circuit board is formed in such a way that the metal pillar 5 is arranged inside the through hole 4 in the ceramic board 1 comprising the through hole 4, that the metal circuit boards 3, 3 are attached to, and mounted on, both faces of the ceramic board 1 so as to close the through hole 4, and that the metal pillar 5 and the circuit boards 3 are bonded via a solder material 6. The solder material 6 is spread to the boards 3 from ends of the metal pillar 5. Even when a large current is applied, the concentration of the current is hard to generate, and the heat is not generated in the connection parts of the metal pillar 5 to the boards 3 on both faces of the ceramic board 1.
Inventors:
Ken Furukuwa
Application Number:
JP2001362389A
Publication Date:
May 30, 2007
Filing Date:
November 28, 2001
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H05K1/11; H05K3/20; H05K3/40; (IPC1-7): H05K1/11; H05K3/20; H05K3/40
Domestic Patent References:
| JP5121845A | ||||
| JP62250688A | ||||
| JP9129769A | ||||
| JP8298362A | ||||
| JP6120634A | ||||
| JP2003133673A |
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