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Title:
CERAMIC COMPACT BONDING DEVICE AND METHOD OF MANUFACTURING CERAMIC BONDED COMPACT
Document Type and Number:
Japanese Patent JP2003073177
Kind Code:
A
Abstract:

To provide a ceramic compact bonding device capable of bonding a sintered compact plate with other ceramic compact or metal piece of smaller diameter without deformation of the sintered ceramic compact plate, and a manufacturing method of a bonded compact using the same.

The ceramic bonded compact is manufactured as follows. On a pedestal 5 provided in a furnace 2 the sintered compact plate 51 is placed and other ceramic sintered compact or metal piece of smaller diameter is placed thereon, and the contact surface between the sintered compact plate 51 and other ceramic sintered compact or metal piece smaller diameter is loaded by a 1st pressing shaft 10 via a 1st pressing jig 18, and the exposing surface of the sintered compact plate 51 except the above contact surface is loaded by a 2nd pressing shaft 13 via a 2nd pressing jig 21, then both the compacts or compact and metal piece are bonded by heating under practically similar a pressing load.


Inventors:
NAKAMURA TSUNEHIKO
Application Number:
JP2001000263113
Publication Date:
March 12, 2003
Filing Date:
August 31, 2001
Export Citation:
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Assignee:
KYOCERA CORP
International Classes:
C04B37/00; C04B37/02; (IPC1-7): C04B37/00; C04B37/02
Domestic Patent References:
JPH06241662A1994-09-02
JPH02295700A1990-12-06
JPH10167850A1998-06-23