To provide a ceramic composition baked at a low temperature capable of baking coincidently with a low resistant conductor such as copper or silver, with a high specific dielectric constant, low tan δ, and a small absolute value of the changing ratio of the specific dielectric constant by temperature change, and provide multi-layer wiring board using it for a part of insulating substrate.
The low temperature sintered ceramic composition containing SiO2 of 10-30 wt.%, MgO of 1-10 wt.%, CaO of 5-15 wt.%, TiO2 of 15-30 wt.% and La2O3 of 5-25 wt.%, with the specific dielectric constant of ≥14 at 1 MHz-3 GHz, dielectric loss of ≤50×10-4, the absolute value of the changing ratio of the dielectric constant by the temperature change of ≤100×10-6/°C at -40-85°C, and is used for inside insulating layer 1b of the multi-layer wiring board. On both the upper/lower faces of the insulator layer 1b the electrodes 3, 3 are formed and provides a built in capacitor in the multi-layer wiring board.
SUZUKI SHINICHI
NAGAE KENICHI
KIMURA TETSUYA
KOKUBU MASAYA
| JPH07272537A | 1995-10-20 | |||
| JPH0873239A | 1996-03-19 | |||
| JPH08259264A | 1996-10-08 | |||
| JPH06215629A | 1994-08-05 | |||
| JPH07272537A | 1995-10-20 | |||
| JPH0873239A | 1996-03-19 | |||
| JPH08259264A | 1996-10-08 | |||
| JPH06215629A | 1994-08-05 |