Title:
CERAMIC CORE AND MANUFACTURING METHOD THEREOF AND CHIP-SHAPED ELECTRONIC COMPONENTS USING THE SAME
Document Type and Number:
Japanese Patent JP2011223025
Kind Code:
A
Abstract:
To provide an ultrasmall chip-shaped electronic component and a ceramic core used therein, which secures the necessary bonding strength of electrode terminals when mounted on a circuit board.
A ceramic core comprises a core part and a leg for holding the core part by both edges thereof, measuring 1.1 mm or less in the lengthwise direction and 0.6 mm or less in the breadthwise direction in a plan view. The edge of a protruding part of the leg in the breadthwise direction of the ceramic core has its corners and ridgelines curved at a radius of curvature of 5-25 μm.
Inventors:
UEDAHIRA TOSHIO
MATSUMOTO YOSHIHIRO
MATSUMOTO YOSHIHIRO
Application Number:
JP2011148252A
Publication Date:
November 04, 2011
Filing Date:
July 04, 2011
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H01F17/04; H01F27/255; H01F41/02
Domestic Patent References:
JPH07278607A | 1995-10-24 | |||
JP2003068549A | 2003-03-07 | |||
JP2001035737A | 2001-02-09 | |||
JP2004023333A | 2004-01-22 | |||
JPH05275256A | 1993-10-22 | |||
JPS6436107U | 1989-03-06 | |||
JPS63319107A | 1988-12-27 | |||
JPH08213719A | 1996-08-20 |
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