Title:
CERAMIC ELECTRONIC COMPONENT, AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT MOUNTING SUBSTRATE
Document Type and Number:
Japanese Patent JP2019012749
Kind Code:
A
Abstract:
To provide a ceramic electronic component capable of improving the bonding reliability between an external electrode and a metal terminal and a manufacturing method thereof.SOLUTION: A ceramic electronic component 10 includes a ceramic element body 11, sintered metal films 14 and 15, and metal terminals 16 and 17. The ceramic body has internal electrodes 12 and 13. The sintered metal film has bonding surfaces 14a and 15a having a surface roughness Ra of 0.200 μm or less and is connected to the internal electrodes and formed on the surface of the ceramic element body. The metal terminal is bonded to the bonding surface.SELECTED DRAWING: Figure 2
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Inventors:
MOCHIGI MASAKI
SATO KAZUYA
NAKATA YOSUKE
SATO KAZUYA
NAKATA YOSUKE
Application Number:
JP2017127870A
Publication Date:
January 24, 2019
Filing Date:
June 29, 2017
Export Citation:
Assignee:
TAIYO YUDEN KK
International Classes:
H01G4/232; H01G2/06; H01G4/228; H01G4/30; H05K1/18; H05K3/34
Domestic Patent References:
| JP2012212860A | 2012-11-01 | |||
| JP2011238834A | 2011-11-24 | |||
| JP2008028064A | 2008-02-07 | |||
| JP2000223358A | 2000-08-11 | |||
| JP2016100574A | 2016-05-30 | |||
| JP2012134286A | 2012-07-12 |
Attorney, Agent or Firm:
Junichi Omori
Masayoshi Sekine
Masayoshi Sekine