Title:
CERAMIC ELECTRONIC COMPONENT AND MOUNTING STRUCTURE THEREOF
Document Type and Number:
Japanese Patent JP2019009360
Kind Code:
A
Abstract:
To provide a ceramic electronic component with a metal terminal capable of being surely welded and mounted even when a mounting board is warped or a connecting portion is not in one plane due to a step difference, and a mounting structure thereof.SOLUTION: In a ceramic electronic component 10, a part of a first metal terminal 40a and a second metal terminal 40b formed from lead frame are covered with an exterior resin material 70. The first metal terminal includes a first terminal joining portion, a first extension portion 44 extending from the first terminal joining portion in the direction of the mounting surface, and a second mounting portion 46 connected to the first extension portion and extending to the side opposite to the electronic component body side. The second metal terminal includes a second terminal joining portion, a second extension portion 54 extending in the direction of the mounting surface, and a second extension portion 56 connected to the second extension portion and extending to the side opposite to the electronic component body side. The first mounting portion and the second mounting portion are provided with a first convex portion and a second convex portion protruding toward the mounting surface side, and a protruding portion 72 protruding toward the mounting surface side is provided in an exterior resin material.SELECTED DRAWING: Figure 1
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Inventors:
AKIYOSHI TEPPEI
Application Number:
JP2017125649A
Publication Date:
January 17, 2019
Filing Date:
June 27, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H01G2/06; H01G4/228; H01G4/232; H01G4/30
Attorney, Agent or Firm:
Masahiro Okada
Ichi Ogiya
Ichi Ogiya