Title:
セラミック電子部品およびその製造方法
Document Type and Number:
Japanese Patent JP7381272
Kind Code:
B2
Abstract:
A ceramic electronic device includes: a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, the multilayer chip having a rectangular parallelepiped shape, the plurality of internal electrode layers being alternately exposed to a first end face and a second end face of the multilayer chip, the first end face facing with the second end face, a first external electrode provided on the first end face; a second external electrode provided on the second end face; and an organic compound that is adhered to at least a part of a region including a surface of the multilayer chip where neither the first external electrode nor the second external electrode is formed and surfaces of the first external electrode and the second external electrode, and has a siloxane bonding.
Inventors:
Kiyoshiro Yatagawa
Satoshi Kobayashi
Takahisa Fukuda
Satoshi Kobayashi
Takahisa Fukuda
Application Number:
JP2019174522A
Publication Date:
November 15, 2023
Filing Date:
September 25, 2019
Export Citation:
Assignee:
TAIYO YUDEN CO.,LTD.
International Classes:
H01G4/224; H01G4/30
Domestic Patent References:
| JP2015198235A | ||||
| JP2017157805A | ||||
| JP2003017374A | ||||
| JP2012069827A | ||||
| JP2000277373A | ||||
| JP2016063079A | ||||
| JP2013026392A | ||||
| JP2010278373A |
Foreign References:
| US20160042864 |
Attorney, Agent or Firm:
Shuhei Katayama
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