Title:
セラミック電子部品及び配線基板
Document Type and Number:
Japanese Patent JP5463195
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a ceramic electronic component having excellent electric characteristic with favorable adhesion of a surface electrode to a dielectric base body on which the surface electrode is provided, and a wiring board provided with the ceramic electronic component having such characteristic.SOLUTION: The surface electrode within the ceramic electronic component has an inner layer and an outer layer covering the inner layer, the inner layer includes a ceramic part having the same component as the main component of the dielectric base body, and a volume proportion of the ceramic part within the inner layer on the dielectric base body is larger than a volume proportion of the ceramic part on a veer conductor. The ceramic electronic component is built in to constitute the wiring board.
Inventors:
Takamichi Ogawa
Hiroshi Yamamoto
Jun Otsuka
Hiroshi Yamamoto
Jun Otsuka
Application Number:
JP2010099158A
Publication Date:
April 09, 2014
Filing Date:
April 22, 2010
Export Citation:
Assignee:
Nippon Special Ceramics Co., Ltd.
International Classes:
H01G4/232; H01G4/30; H05K3/46
Domestic Patent References:
| JP200866712A | ||||
| JP3535998B2 | ||||
| JP200781351A | ||||
| JP2009147178A | ||||
| JP2009283733A | ||||
| JP2007150123A | ||||
| JP2000277371A | ||||
| JP4260316A |
Attorney, Agent or Firm:
Naoki Fukumura
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