Title:
CERAMIC LID SUBSTRATE FOR SEMICONDUCTOR PACKAGE
Document Type and Number:
Japanese Patent JP3417608
Kind Code:
B2
Abstract:
PURPOSE: To provide a lid substrate on which a recessed groove to be used to discharge the expanded gas generated when sealing is simultaneously formed in a solder layer forming process without necessity for any other independent processes, etc.
CONSTITUTION: The width W1 of the part along the longitudinal side 3 of a substrate 2 and the width W2 of the part along the lateral side 4 of the metal layer 5, to be used as the base layer where a solder layer is provided, are changed to W1>W2. When solder is adhered to the above-mentioned metal layer 5, using a dipping method and the like, the part along the longitudinal side 3 of wide width becomes thicker than the part along the lateral side 4 of narrow width by the surface tension of the fused solder. As a result, the part of the solder layer of the part along the lateral side 4 of narrow width forms a recessed groove relatively.
Inventors:
Kazuo Kimura
Haruhiko Murata
Yukihiro Aoyama
Haruhiko Murata
Yukihiro Aoyama
Application Number:
JP21238593A
Publication Date:
June 16, 2003
Filing Date:
August 03, 1993
Export Citation:
Assignee:
Nippon Special Ceramics Co., Ltd.
International Classes:
H01L23/02; H01L23/04; (IPC1-7): H01L23/02
Domestic Patent References:
| JP63104355A | ||||
| JP61248536A | ||||
| JP6384956U | ||||
| JP6315052U |
Attorney, Agent or Firm:
Kazuhisa Kato