Title:
CERAMIC MULTILAYER INTERCONNECTION BOARD WITH COPPER PLATE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH07335781
Kind Code:
A
Abstract:
PURPOSE: To provide a downsized and high value added substrate and its manufacture by directly bonding interconnection materials such as W and Mo with a copper plate.
CONSTITUTION: Copper plates 4 are provided on one plane or both planes of a ceramic multilayer substrate which incorporates an interconnecting conductor 2 which has W and/or Mo as a major component. The copper plate 4 is permitted to have a composition that has a 0-30wt.% of Al2O3 to the metal component composed of 40-90wt.% of W and/or Mo and 10-60wt.% of Ir, and the copper plates 4 are connected with an interconnecting conductor layer 2 through a thick film conductor 3 formed in a through hole.
Inventors:
TANIFUJI NOZOMI
NAITO AKIHIKO
OKUMURA KOSEI
NAITO AKIHIKO
OKUMURA KOSEI
Application Number:
JP13053594A
Publication Date:
December 22, 1995
Filing Date:
June 13, 1994
Export Citation:
Assignee:
SUMITOMO KINZOKU CERAMICS KK
International Classes:
H01L23/12; H05K1/00; H05K1/09; (IPC1-7): H01L23/12
Attorney, Agent or Firm:
Hidetake Komatsu (3 outside)