Title:
CERAMIC PACKAGE FOR SEMICONDUCTOR CHIP
Document Type and Number:
Japanese Patent JPH0232557
Kind Code:
A
Abstract:
PURPOSE: To improve heat conduction to a radiator and radiation effect and to simplify the structure and manufacturing process by forming a junction of a package body and the radiator by the same material in one-piece structure.
CONSTITUTION: A junction 10a to connect a semiconductor IC chip 3 through a metallize layer 2 and a radiator section 10b of a package body 10 are made of the same material in one-piece structure. Since there is no area to obstruct heat conduction in a radiation path to conduct heat generated from the chip 3 to the radiator section 10b, uniform heat conduction can be obtained according to materials used for the radiation path. Good radiation effect can be thereby acquired.
Inventors:
SHIMIZU KOICHI
Application Number:
JP18292888A
Publication Date:
February 02, 1990
Filing Date:
July 22, 1988
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/36; (IPC1-7): H01L23/36
Domestic Patent References:
| JPS6381956A | 1988-04-12 |
Attorney, Agent or Firm:
Mamoru Takada (1 person outside)
Next Patent: JPH0232558