PURPOSE: To prevent adhesion between a conductor circuit layer and a ceramic substrate from deteriorating due to diffusion of a tin component of solder even at a high use temperature of a conductor circuit layer after mounted when a part is mounted by using solder comprised of tin and lead on a conductor circuit layer.
CONSTITUTION: In a ceramic printed wiring board wherein a conductor circuit layer 6 is formed of a foundation layer 2 constituted of an electroless plating layer on a surface of a ceramic substrate 1, a second intermediate layer 4 constituted of a palladium layer 4p on an upper surface of the foundation layer 2 and a surface layer 5 constituted of a gold layer 5k on an upper surface of the second intermediate layer 4, a first intermediate layer 3 constituted of an electrolytic plating copper layer 3d is formed between the foundation layer 2 and the second intermediate layer 4, a film thickness of the first intermediate layer 3 is 1 to 10μm and a film thickness of the foundation layer 2 is 0.1 to 10μm.
| JP2006135206 | PLATING METHOD |
| JPH04346487 | PRINTED BOARD AND MANUFACTURE THEREOF |
| JPS618989 | ELECTRIC CIRCUIT TRANSFERRING METHOD |
MORIOKA KAZUNOBU
KANETANI DAISUKE
FUKUYA NAOHITO
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