Title:
セラミックス加工方法
Document Type and Number:
Japanese Patent JP5884614
Kind Code:
B2
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Inventors:
Hiroyuki Matsuo
Application Number:
JP2012089972A
Publication Date:
March 15, 2016
Filing Date:
April 11, 2012
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
C04B41/91; B23K26/382; B23K26/40; H01L23/12; H03H9/02
Domestic Patent References:
| JP2009226475A | ||||
| JP2010247230A | ||||
| JP2009523616A | ||||
| JP2005503266A | ||||
| JP2005205469A | ||||
| JP2005050875A | ||||
| JP2011155506A | ||||
| JP3133588A | ||||
| JP7283510A | ||||
| JP2011515228A | ||||
| JP2007038245A |
Foreign References:
| US20020170891 |
Attorney, Agent or Firm:
Masahiko Ueyanagi
Osamu Suzawa
Osamu Suzawa