CERAMIC SUBSTRATE PROVIDED WITH METAL CHANGING THROUGH HOLE FOR HIGHBRID MICROCIRCUIT AND ITS MANUFACTURE

Japanese Patent JPH02216853

A

PURPOSE: To eliminate the need for a long conductive path for grounding and, at the same time, to efficiently radiate heat from a hybrid microcircuit by mounting the electronic element of the circuit on the upper surface of a sheet of a ceramic material so that the element can cover through holes and using metallic fillers in the through holes for grounding the electronic element. CONSTITUTION: An alumina substrate 65 having a grounding surface 82 on the bottom has seven through holes 67, 68, 69, 70, 71, 72, and 73 filled with a composite metal. A single GaAs die 74 is mounted on a substrate 65 so that the die 74 can cover the closely arranged through holes 67 and 68 filled with the composite metal and the die 74 provides a simplified hybrid microcircuit. The die 74 is provided with a primary ground 84 directly in contact with the metallic fillers in the holes 67 and 68 and the bottom faces of the metallic fillers are brought into contact with the grounding a surface 82 of the substrate 65. The use of the two holes 67 and 68 becomes necessary when it is required to more quickly remove the heat generated in one through hole filled with the metal.

EMU PII RAMACHIYANDORA PANITSU
ANIRU KEI AGARUWARU

JP28506089A

August 29, 1990

November 02, 1989

Click for automatic bibliography generation  

MICRO SUTORATESU INC

H01L21/48; H01L23/12; H01L23/055; H01L23/498; H01L23/66; H05K3/40; H05K1/03; (IPC1-7): H01L23/12

JPS5954247A	1984-03-29
JPS62174341U	1987-11-05
JPS61182247A	1986-08-14
JPS6413755A	1989-01-18

Motohiro Kurauchi (1 outside)

Previous Patent: HIGH BREAKDOWN STRENGTH SEMICONDUCTOR DEVICE

Next Patent: POROUS ELECTRONIC COMPONENT SEALED MOLDING