Title:
CERAMIC WIRING BOARD AND METHOD OF MANUFACTURING IT
Document Type and Number:
Japanese Patent JP3652196
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a glass ceramic wiring board which can control the shrinkage in plan direction and enable fine wiring with excellent surface.
SOLUTION: The glass ceramic wiring board on the surface of which the area ratio of voids is adjusted to ≤5% is manufactured in such a way that green sheets composed of a glass ceramic composition containing ≥20 vol.% amorphous component after burning are prepared, and wiring circuit layers composed of high-purity metallic conductors containing ≥99.5 wt.% metallic component are respectively formed on the surfaces of the green sheets. Then the green sheets are laminated upon another and a constraining sheet which is composed mainly of a hardly sinterable ceramic material and containing 0.5-15 vol.% amorphous component is formed on at least one surface of the laminated green sheet body. Finally, the laminated body is sintered and the constraint sheet is removed.
Inventors:
Tetsuya Kimura
Katsuhiko Onizuka
Katsuhiko Onizuka
Application Number:
JP36687099A
Publication Date:
May 25, 2005
Filing Date:
December 24, 1999
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H05K1/03; C04B35/00; C04B35/495; H05K1/09; H05K3/46; (IPC1-7): H05K1/03; C04B35/495; H05K1/09; H05K3/46
Domestic Patent References:
| JP10242644A | ||||
| JP6305770A | ||||
| JP11177238A |
Previous Patent: SOLD ELECTROLYTE FUEL CELL
Next Patent: COMMUNICATION EQUIPMENT AND ITS CONTROLLING METHOD
Next Patent: COMMUNICATION EQUIPMENT AND ITS CONTROLLING METHOD