PURPOSE: To allow the ceramic section not to be exposed even when the conductor metal of through-hole sections is exposed on the grinding surface during grinding for glazing by forming all through-holes so as to project from the surface of ceramic board when firing them on the exposed surface of the ceramic wiring board.
CONSTITUTION: All through-holes 1 on the exposed surface where a ceramic wiring board is fired are formed so as to project from the surface of board ceramic 4. The contraction amount of conductor paste during firing is controlled to regulate the projection amount by adjusting the grain size of metallic powder of the conductor paste to be filled in the through-holes 1 of which green sheet becomes front/back face when piling up layers. Therefore, when the contraction ratio of the conductor paste is smaller than that of the green sheet, the through- holes 1 are formed to project from the surface 4 corresponding to the difference of contraction ratio. Furthermore, even when the conductor metal of through- hole section is exposed on the grinding surface during grinding for glazing treatment, a ceramic section 2 is not exposed.
FUJITA TAKESHI
KUROKI TAKASHI
AMI NORIHIRO
NOMA TATSUJI
