Title:
CERIUM OXIDE ABRASIVE AND METHOD FOR POLISHING SUBSTRATE
Document Type and Number:
Japanese Patent JP3462052
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an abrasive which can be used for polishing a surface to be polished not only with no flaws, but also with high speed, by preparing a primary powder of CeO2 which has specific values with respect to a range, a central value, and a maximum value for particle diameters; mixing the primary powder with an aqueous solution containing ammo nium polyacrylate as a dispersant; and processing the mixture into a slurry comprising a powder having specific values with respect to a range, a central value, and a maximum value for particle diameters, dispersed in the solution.
SOLUTION: A cerium compound such as Ce(CO3)2.2H2O is calcined at 600 to 900°C for 5 to 300min under an oxidative atmosphere to produce CeO2, then the product is crushed using a jet mill, thereby obtaining a primary CeO2 powder having a particle diameter range of 10 to 600nm, a central value of 100 to 250nm and a maximum value of 600nm or less. The CeO2 powder is mixed with an aqueous solution of a dispersnat such as ammonium polyacrylate, and the mixture is subjected to ultrasonic dispersion with stirring, to thereby prepare a slurry. The slurry is diluted with additional water and is passed through a filter, to obtain an abrasive in a slurry form containing, dispersed therein, a CeO2 powder having a specific surface area of 7 to 45m2/g, a Zeta potential of -100mV to -10mV, an average particle diameter of 200 to 400nm, a width for a half value in a particle size distribution of 300nm or less and a pH of 7 to 10.
Inventors:
Makoto Yoshida
Toranosuke Ashizawa
Hiroki Terasaki
Yasushi Kurata
Jun Matsuzawa
Kiyohito Tanno
Hiroto Ohtsuki
Toranosuke Ashizawa
Hiroki Terasaki
Yasushi Kurata
Jun Matsuzawa
Kiyohito Tanno
Hiroto Ohtsuki
Application Number:
JP26597997A
Publication Date:
November 05, 2003
Filing Date:
September 30, 1997
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
B24B37/00; C01F17/00; C08K3/22; C08L101/00; C09C1/68; C09K3/14; H01L21/304; (IPC1-7): C09K3/14; B24B37/00; C01F17/00; H01L21/304
Domestic Patent References:
| JP8134435A | ||||
| JP8153696A | ||||
| JP881218A | ||||
| JP10106994A | ||||
| JP10102038A | ||||
| JP822970A | ||||
| JP6330025A | ||||
| JP6216096A | ||||
| JP536756B2 |
Other References:
【文献】社団法人日本分析学会X線分析研究懇談会主催で1999年12月6日~9日に開催された「第9回X線分析講習会 粉末X線リートベルト解析」おける講義資料、53頁~76頁「3.粉末X線回折データのリートベルト解析 無機材質研究所 泉富士夫」および163頁~193頁「8.Rietveld法の材料解析への応用 物質工学工業技術研究所 秋葉悦男」
Attorney, Agent or Firm:
Hidekazu Miyoshi