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Title:
酸化セリウム研磨粒子及び該研磨粒子を含む組成物
Document Type and Number:
Japanese Patent JP4951218
Kind Code:
B2
Abstract:

To provide cerium oxide abrasive particles and a composition containing the abrasive particles.

There is provided a method of manufacturing an improved cerium oxide abrasive agent suitable for forming a slurry comosition which is suitable for a CMP process, wherein the cerium oxide abrasive agent is manufactured, by heat-treating a mixture of cerium precursors, under the condition of forming a yet larger secondary abrasive particle which is constituted by bonding of cerium oxide primary particles. This contributes to reducing the possibility that a mechanical strength is deteriorated due to the existence of incompletely oxidized cerium in the structure of the cerium oxide primary particles and/or secondary abrasive particles, thereby damaging the surface of a substrate during CMP process using the abrasive agent.

COPYRIGHT: (C)2006,JPO&NCIPI


Inventors:
Lee Dong
Su Ken
Kim Man
Ginger scenery Bun
Application Number:
JP2005207495A
Publication Date:
June 13, 2012
Filing Date:
July 15, 2005
Export Citation:
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Assignee:
Samsung Electronics Co.,Ltd.
International Classes:
H01L21/304; B24B37/00; C01F17/00; C09K3/14
Domestic Patent References:
JP2004168638A
JP2004168639A
JP11012561A
JP2004155914A
JP2001323255A
JP2005509080A
JP10152673A
JP2003277731A
Foreign References:
WO2003042310A1
WO2000073211A1
WO2002028979A1
WO2005110679A1
Attorney, Agent or Firm:
Mikio Hatta
Yasuo Nara
Katsuyuki Utani



 
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