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Patent Searching and Data


Title:
CERTIFYING DEVICE OF SOLDER MATERIAL
Document Type and Number:
Japanese Patent JPH11160220
Kind Code:
A
Abstract:

To permit the simplification of inspection work and accurate inspection by permitting the mechanical certification of a solder material and eliminating the need for removing an oxide film on the surface of molten solder liquid.

A certifying device of solder materials comprises a large-volume solder housing tank 1 in which molten solder 3 is housed, a small-volume moving solder housing tank 5 to permit immersion in the molten solder 3 and its pumping-up, a movement control means 4 of the moving solder housing tank 5, and a supporting frame 8 with heat resistance to place a sample to support a film with good thermal conductivity. The supporting frame 8 places the film above the large-volume solder housing tank 1 at its one set location. The moving solder housing tank 5 pumps up the molten solder 3 in the large-volume solder housing tank 1 by the movement control means 4 to elevate the liquid level of the molten solder 3 to a location in contact with the film and make the heat of the molten solder transferred to a sample via the film to fuse the sample to perform the certification of characteristics.


Inventors:
OKUYAMA MAKIKO
Application Number:
JP32630597A
Publication Date:
June 18, 1999
Filing Date:
November 27, 1997
Export Citation:
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Assignee:
SONY CORP
International Classes:
G01N13/02; B23K1/00; G01N33/20; (IPC1-7): G01N13/02; B23K1/00; G01N33/20
Attorney, Agent or Firm:
Hidekuma Matsukuma