Title:
CHAIN-LIKE BGA-TYPE PLASTIC PACKAGE
Document Type and Number:
Japanese Patent JP2002280395
Kind Code:
A
Abstract:
To provide a chain-like BGA-type plastic package, composed of only a plurality of continuously fixed nondefectives among inspected individual BGA- type plastic packages which can be obtained from a panel-like copper-lined substrate with high yield.
The chain-like BGA-type plastic package 10 is composed of a plurality of continuously arrayed individual BGA type plastic packages 11, each having conductor patterns 15, 16 on both sides of a copper lined resin substrate 14, products 12 and non-product parts 13 connected to the products 12. The individual BGA type plastic packages 11 individually cut off are fixed continuously at their non-product parts 13 onto two rail-like carriages 17.
Inventors:
SHIRAISHI KATSUHISA
Application Number:
JP2001082679A
Publication Date:
September 27, 2002
Filing Date:
March 22, 2001
Export Citation:
Assignee:
SUMITOMO METAL ELECTRONICS DEV
International Classes:
H01L23/12; H01L21/50; (IPC1-7): H01L21/50; H01L23/12
Attorney, Agent or Firm:
Nakamae Fujio