Title:
面取り研削方法及び面取り研削装置
Document Type and Number:
Japanese Patent JP6976713
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide preferable surface roughness even when it is a process of grinding a notch groove, to reduce load of polishing process that is post-process, thereby improving final surface roughness and shape accuracy.SOLUTION: In a chamfer grinding method for grinding an end face of a plate-like material W to be processed with a grinding abrasive wheel, the grinding abrasive wheel includes: a groove part 72-4 parallel to an axial direction, as a processing groove 72-1; and slopes 72-2, 72-3 formed in an upper and a lower of the groove part. The chamfer grinding method includes: rotating the grinding abrasive wheel and providing supersonic vibration in an axial direction to the grinding abrasive wheel; and pressing the processing groove 72-1 at the end face of the material W to be processed from a vertical direction so that they abut on each other to grind the object.SELECTED DRAWING: Figure 9
Inventors:
Katayama Sho
Inamura Masato
Inamura Masato
Application Number:
JP2017096163A
Publication Date:
December 08, 2021
Filing Date:
May 15, 2017
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
B24B9/00; B24B1/04; H01L21/304
Domestic Patent References:
| JP2008155287A | ||||
| JP2015174180A | ||||
| JP7100753A | ||||
| JP62162451A | ||||
| JP2005153129A | ||||
| JP9168947A | ||||
| JP2005231022A | ||||
| JP2015223669A | ||||
| JP2010207984A |
Attorney, Agent or Firm:
Yoshinobu Kanayama