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Title:
CHAMFER GRINDING METHOD AND CHAMFER GRINDING DEVICE
Document Type and Number:
Japanese Patent JP2022047538
Kind Code:
A
Abstract:
To provide preferable surface roughness even when it is a process of grinding a notch groove, to reduce load of polishing process that is post-process, thereby improving final surface roughness and shape accuracy.SOLUTION: In a chamfer grinding method for grinding an end face of a plate-like material W to be processed with a grinding abrasive wheel 72, the grinding abrasive wheel 72 includes: a groove part 72-4 parallel to an axial direction, as a processing groove 72-1; and slopes 72-2, 72-3 formed in an upper and a lower of the groove part. The chamfer grinding method includes: rotating the grinding abrasive wheel 72 and providing supersonic vibration in an axial direction to the grinding abrasive wheel; and pressing the processing groove 72-1 at the end face of the material W to be processed from a vertical direction so that they abut on each other to grind the object.SELECTED DRAWING: Figure 9

Inventors:
KATAYAMA SHO
INAMURA MASATO
Application Number:
JP2021180057A
Publication Date:
March 24, 2022
Filing Date:
November 04, 2021
Export Citation:
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Assignee:
TOKYO SEIMITSU CO LTD
International Classes:
B24B1/04; B24B9/00; H01L21/304
Domestic Patent References:
JP2015174180A2015-10-05
JP2005153129A2005-06-16
JPH09168947A1997-06-30
JP2010207984A2010-09-24
JP2005231022A2005-09-02
JP2008155287A2008-07-10
JP2015223669A2015-12-14
JPH07100753A1995-04-18
JPS62162451A1987-07-18
Attorney, Agent or Firm:
Yoshinobu Kanayama
Shohei Sakai