Title:
CHAMFERING DIE AND CHAMFERING METHOD USING THE SAME DIE
Document Type and Number:
Japanese Patent JP3664880
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a chamfering die with which the effect of the accuracy of the stroke of a die to chamfering dimensions is suppressible and to provide chamfering method using this die.
SOLUTION: In the chamfering die 1 for simultaneously forming chamfered parts 13 on both faces in the edge part of the slit of an inner plate with each chamfering punch 25U, 25L on an upper die side 3 and lower die 5 side, the chamfering punch 25L on the lower die 5 side is energized with cone disk springs 33. A slitting punch 15, punch plate 17 and pressure receiving plate 19 are provided on the upper die 3 and they are ascendable and descendable as one body with the upper die 3. On the fixed lower die 5, a slitting die 21 is provided opposing the slitting punch 15.
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Inventors:
Tetsuo Yaguchi
Hiroshi Ikemoto
Yujisawa Yuji
Hiroshi Ikemoto
Yujisawa Yuji
Application Number:
JP19342898A
Publication Date:
June 29, 2005
Filing Date:
July 08, 1998
Export Citation:
Assignee:
Tochigi Fuji Sangyo Co., Ltd.
Kuroda Seiko Co., Ltd.
Kuroda Seiko Co., Ltd.
International Classes:
B21D22/02; B21D19/00; B21D28/00; B21D28/22; B21D31/00; B30B1/00; (IPC1-7): B21D19/00; B21D22/02
Domestic Patent References:
| JP2046927A | ||||
| JP51013490A | ||||
| JP11333523A |
Foreign References:
| US3796086 | ||||
| US3895922 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
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