To provide a chamfering method of a notch part, obtaining a favorable finished surface roughness in chamfering for the notch part of a notched wafer.

When the direction of connecting the center of the wafer W and the center of the notch part is taken as Y-direction, chambering is performed with the axis of a notch chamfering grinding wheel 58 inclined in the Y-direction by a designated amount and the direction of motion of abrasive grains of the notch chamfering grinding wheel 58 intersects the rotating direction of the wafer W. Thus, machined surface roughness can be improved.