Title:
Charged particle beam masking for laser ablation detailed machining
Document Type and Number:
Japanese Patent JP6129237
Kind Code:
B2
Abstract:
Improved method of and system for substrate micromachining is described. Preferred embodiments of the present invention provide improved methods for the utilization of charged particle beam masking and laser ablation. A combination of the advantages of charged particle beam mask fabrication and ultra short pulse laser ablation are used to significantly reduce substrate processing time and improve lateral resolution and aspect ratio of features machined by laser ablation to preferably smaller than the diffraction limit of the machining laser.
Inventors:
Marcus Straw
Milos Toss
Mark Wutroth
Stephen Randolph
Michael resource
Milos Toss
Mark Wutroth
Stephen Randolph
Michael resource
Application Number:
JP2015111004A
Publication Date:
May 17, 2017
Filing Date:
May 31, 2015
Export Citation:
Assignee:
F-I-I Company
International Classes:
G03F7/20; B23K26/00; B23K26/066; B23K26/18; B23K26/361; H01J37/305; H01J37/317
Domestic Patent References:
JP59104287A | ||||
JP2006005110A | ||||
JP5173316A | ||||
JP5136097A | ||||
JP2008078634A | ||||
JP63134679A | ||||
JP9045639A | ||||
JP2004528181A | ||||
JP2004512672A | ||||
JP2020685A | ||||
JP4354321A |
Attorney, Agent or Firm:
Masahiko Amagai