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Patent Searching and Data


Title:
CHASSIS FRAME
Document Type and Number:
Japanese Patent JP2004074819
Kind Code:
A
Abstract:

To provide a chassis frame having a bonding structure which does not require cutting or the like using laser while achieving high strength without using an auxiliary member for purposes of reduction of the number of parts.

The chassis frame 1 includes a side member 4 abutted and joined on a front end cross member 5. A side member end 3 as a tube body is gradually enlarged to a front end cross member outer surface 2, and bonding flanges 9, 10 are formed on the side member end 3. The side member end 3 with the bonding flanges 9, 10 formed thereon has a flattering shape of the front end cross member outer surface 2 in side view, and the bonding flanges 9, 10 are abutted on the front end cross member outer surface 2, and the side member end 3 is joined to the front end cross member 5.


Inventors:
TAGUCHI FUMIKAZU
SOUDA MITSUYOSHI
KUNIHASHI KIYOMI
Application Number:
JP2002233548A
Publication Date:
March 11, 2004
Filing Date:
August 09, 2002
Export Citation:
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Assignee:
HIRUTA KOGYO CO LTD
International Classes:
B62D25/20; B62D21/02; (IPC1-7): B62D21/02; B62D25/20
Attorney, Agent or Firm:
Hirosaburo Mori
Toshio Mori
Shigeki Nakatsugu