To provide a resist composition, superior in transmittance to a light of ≤170 nm wavelength and suitable particularly for use in F2 excimer laser lithography.
The chemical amplification resist composition contains a resin binder and a radiation-sensitive compound. The resin binder is alkali-soluble or is made alkali-soluble by chemical changes caused by the action of the radiation sensitive compound after irradiation and has a polymerization unit, derived from a monomer of formula (I) (where Q is H, methyl or a 1-4C fluoroalkyl; R1 is a 1-14C alkyl which may be substituted by halogen, hydroxyl or an alicyclic ring, or an alicyclic or lactone ring which in turn may be substituted by halogen, hydroxyl or alkyl; and at least one of Q and R1 has at least one fluorine atom).
HASHIMOTO KAZUHIKO
MIYA YOSHIKO
INOUE HIROTAKA
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