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Title:
CHEMICAL AMPLIFICATION TYPE PHOTORESIST COMPOSITION
Document Type and Number:
Japanese Patent JP3712218
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To obtain a photoresist compsn. having high transparency to ArF excimer laser light, exhibiting superior sensitivity, resist pattern shape, dry etching resistance and adhesion and having high affinity for an alkali by incorporating acrylic resin having specified constituent units and an acid generating agent.
SOLUTION: This photoresist compsn. contains acrylic resin whose alkali solubility is varied by the action of an acid and an acid generating agent. The acrylic resin is a (meth)acrylic acid (co)polymer having constituent units represented by the formula as at least part of the constituent units. In the formula, R1 is H or methyl, each of R2-R4 is H, lower alkyl or lower alkoxy and (n) is 0 or 1. The acrylic resin may be a copolymer of a deriv. of acrylic acid having a dry etching resistance improving group or an acid dissociability protecting group with unsatd. carboxylic acid and other monomer.


Inventors:
Hideo Haneda
Kazuhito Sato
Hiroshi Komano
Application Number:
JP1158197A
Publication Date:
November 02, 2005
Filing Date:
January 24, 1997
Export Citation:
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Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
G03F7/004; C07D307/33; C08F20/28; C08K5/42; C08L33/14; G03F7/039; H01L21/027; (IPC1-7): G03F7/039; C08F20/28; C08L33/14; H01L21/027
Domestic Patent References:
JP9090637A
JP7181677A
JP9073173A
JP7140666A
Attorney, Agent or Firm:
Aun Agata
Takatoshi Mizuguchi



 
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