CHEMICAL MACHINE POLISHING DEVICE CAPABLE OF CONTROLLING SLURRY DISTRIBUTION

Title:

CHEMICAL MACHINE POLISHING DEVICE CAPABLE OF CONTROLLING SLURRY DISTRIBUTION

Document Type and Number:

Japanese Patent JP2001088019

Kind Code:

A

Abstract:

To provide a chemical machine polishing device capable of controlling slurry.

Slurry is dispersed through a screen net in advance before it is supplied to a polishing pad by means of a pump. Thereby the slurry can be supplied to the whole surface of the polishing pad uniformly when it is fed to the pad. Lattice portions of the net are positioned to have different density. Thereby the object to control the distribution of slurry is attained.

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Inventors:

CHIN GAKUCHU
YO MEISEI
WU JUAN-YUAN

Application Number:

JP26796699A

Publication Date:

April 03, 2001

Filing Date:

September 22, 1999

Export Citation:

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Assignee:

UNITED MICROELECTRONICS CORP

International Classes:

B24B57/02; B24B37/00; H01L21/304; (IPC1-7): B24B37/00; B24B57/02; H01L21/304

Attorney, Agent or Firm:

Matsumoto Takemoto (5 outside)

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Next Patent: POLISHING METHOD AND DEVICE FOR WORKPIECE