CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION PREPARING SET, METHOD FOR PREPARING CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION, CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION, AND CHEMICAL MECHANICAL POLISHING METHOD

Title:

Document Type and Number:

Japanese Patent JP2009027142

Kind Code:

A

Abstract:

To provide a method of preparing chemical mechanical polishing aqueous dispersion capable of preventing a surface defect such as dishing, erosion, scratch or fang in a planarization process of a polishing object surface by chemical mechanical polishing, and to provide a chemical mechanical polishing aqueous dispersion preparing set excelling in long-term preservation stability, even in a condensed state.

This chemical mechanical polishing aqueous dispersion preparing set includes a first composition which includes colloidal silica, having an average primary particle diameter of 15-40 nm and a basic compound and has a pH of 8.0-11.0; and a second composition which includes poly(meth)acrylic acid and an organic acid, having two or more carbonyl groups, other than the poly(meth)acrylic acid, and has a pH of 1.0-5.0.

Inventors:

KUNIYA EIICHIRO
SHIDA HIROTAKA
UCHIKURA KAZUICHI

Application Number:

JP2008132955A

Publication Date:

February 05, 2009

Filing Date:

May 21, 2008

Export Citation:

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Assignee:

JSR CORP

International Classes:

H01L21/304; B24B37/00; B82Y10/00; B82Y99/00; C09K3/14

Domestic Patent References:

JP2004335896A	2004-11-25
JP2006287207A	2006-10-19

Foreign References:

WO2007026862A1

2007-03-08

Attorney, Agent or Firm:

Mitsue Obuchi
Yukio Fuse
Mina Tsuzuki

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