Title:
化学的機械的研磨組成物およびその使用方法
Document Type and Number:
Japanese Patent JP4805826
Kind Code:
B2
Abstract:
The invention provides a chemical-mechanical polishing composition comprising: (a) silica particles, (b) about 5×10−3 to about 10 millimoles per kilogram of at least one alkaline earth metal selected from the group consisting of calcium, strontium, barium, and mixtures thereof, based on the total weight of the polishing composition, (c) about 0.1 to about 15 wt. % of an oxidizing agent, and (d) a liquid carrier comprising water. The invention also provides a polishing composition, which optionally comprises an oxidizing agent, comprising about 5×10−3 to about 10 millimoles per kilogram of at least one alkaline earth metal selected from the group consisting of calcium, strontium, and mixtures thereof. The invention further provides methods for polishing a substrate using the aforementioned polishing compositions.
Inventors:
Schroeder, David Jay.
Morgenborg, Kevin Jay.
Morgenborg, Kevin Jay.
Application Number:
JP2006526345A
Publication Date:
November 02, 2011
Filing Date:
September 10, 2004
Export Citation:
Assignee:
CABOT MICROELECTRONICS CORPORATION
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14; H01L21/321
Domestic Patent References:
| JP2001187876A | ||||
| JP2001115146A | ||||
| JP2002528903A | ||||
| JP11080708A |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Yoshihiro Kobayashi
Satoshi Deno
Nagasaka Tomoyasu
Takashi Ishida
Tetsuji Koga
Yoshihiro Kobayashi
Satoshi Deno
Nagasaka Tomoyasu