Title:
CHEMICAL MECHANICAL POLISHING PAD AND POLISHING METHOD
Document Type and Number:
Japanese Patent JP2022112502
Kind Code:
A
Abstract:
To provide improved formulations for making CMP pads, and improved polishing performance.SOLUTION: The invention provides CMP polishing pads or layers made of a polyurethane reaction product of a reaction mixture comprising (i) a liquid aromatic isocyanate component comprising one or more aromatic diisocyanates or a linear aromatic isocyanate-terminated urethane prepolymer, and (ii) a liquid polyol component comprising a) one or more high molecular weight polyols and b) 12 to 40 wt.%, based on the total weight of the liquid polyol component, of a curative mixture of one or more short-chain difunctional polyols having 2 to 9 carbon atoms and a liquid aromatic diamine, where the molar ratio of the total moles of hydroxyl and amino moieties in the liquid polyol, short-chain difunctional polyols and liquid aromatic diamine to moles of isocyanates in the aromatic diisocyanates or linear aromatic isocyanate-terminated urethane prepolymer ranges from 1.0:1.0 to 1.15:1.0.SELECTED DRAWING: None
Inventors:
BRYAN E BARTON
TERESA BRUGAROLAS BRUFAU
TERESA BRUGAROLAS BRUFAU
Application Number:
JP2022006585A
Publication Date:
August 02, 2022
Filing Date:
January 19, 2022
Export Citation:
Assignee:
ROHM & HAAS ELECTRONIC MAT CMP HOLDINGS INC
International Classes:
B24B37/24; B24B37/00; B24B53/017; C08G18/10; C08G18/65; C08G18/76; H01L21/304
Attorney, Agent or Firm:
Patent Attorney Corporation Tsukuni