Title:
半導体製造のための化学機械的研磨システム
Document Type and Number:
Japanese Patent JP4869536
Kind Code:
B2
Abstract:
A method of manufacturing a semiconductor component includes forming a first layer over a semiconductor substrate, providing a mixture comprised of a first component and a second component, optically detecting a concentration of the first component in the mixture, and applying the mixture to the first layer. A chemical-mechanical polishing (CMP) system (100) for use in the method includes a vessel (110) having a first input port (111), a CMP slurry output port (113), and a CMP slurry sensing port (114). The CMP system also includes a refractometer (150) adjacent to the CMP slurry sensing port.
Inventors:
Bunnell, James F.
Bray, Chad Bee.
Bray, Chad Bee.
Application Number:
JP2001585993A
Publication Date:
February 08, 2012
Filing Date:
April 06, 2001
Export Citation:
Assignee:
Freescale Semiconductor, Inc.
International Classes:
H01L21/304; B01F13/08; B01F15/04; B24B37/00; B24B37/04; B24B49/10; B24B57/02; B01F3/08
Domestic Patent References:
| JP2000117635A | 2000-04-25 | |||
| JPH07100738A | 1995-04-18 | |||
| JPH05269462A | 1993-10-19 | |||
| JPH09148286A | 1997-06-06 |
Foreign References:
| US6048256A | 2000-04-11 |
Attorney, Agent or Firm:
Mamoru Kuwagaki