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Title:
CHEMICAL MECHANICAL POLISHING WATER-BASED DISPERSING COMPOSITION FOR POLISHING BARRIER METAL LAYER PROVIDED ON SUBSTRATE FOR USE OF DISPLAY DEVICE, ITS MANUFACTURING METHOD, AND METHOD OF CHEMICAL MECHANICAL POLISHING
Document Type and Number:
Japanese Patent JP2010005704
Kind Code:
A
Abstract:

To provide a chemical mechanical polishing water-based dispersing composition capable of keeping in-plane uniformity of polishing speed and inhibiting variation in in-plane flatness of a polished surface during a process of chemical-mechanical-polishing a barrier metal layer provided on a substrate for use of a display device, a manufacturing method of the chemical mechanical polishing water-based dispersing composition, and a chemical mechanical polishing method using the dispersing composition.

The inventors have found that the problem can be solved by means of the chemical mechanical polishing water-based dispersing composition for polishing the barrier metal layer provided on the substrate for use of the display device, which contains (A) abrasive grains, (B) an organic acid and (C) one or more atoms selected from a group consisting of Ta, Ti and Ru, wherein a ratio Rmax/Rmin of a longer diameter Rmax and a shorter diameter of the (A) abrasive grain ranges from 1.0 to 1.5 and (C) element ranges from 1.0102 to 1.0104 ppm.


Inventors:
NISHIMOTO KAZUO
SHINODA TOMOTAKA
Application Number:
JP2008164123A
Publication Date:
January 14, 2010
Filing Date:
June 24, 2008
Export Citation:
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Assignee:
JSR CORP
International Classes:
B24B37/00; C09K3/14
Domestic Patent References:
JP2001189296A2001-07-10
JP2005082649A2005-03-31
JP2003183633A2003-07-03
JP2006526275A2006-11-16
JP2007221032A2007-08-30
JPH11277434A1999-10-12
Foreign References:
WO2007116770A12007-10-18