To provide a chemical mixer that can supply a chemical mixture to a substrate treating device without degradation over time, and can suppress variations in a mixing ratio between sulfuric acid and hydrogen peroxide to produce a chemical mixture that maintains a constant mixing ratio when producing a chemical mixture.
In a chemical mixer 10, a sulfuric acid flow rate is stabilized by pressure feeding sulfuric acid by pressure feeding means 35, and also a hydrogen peroxide flow rate is stabilized by injecting hydrogen peroxide with a supply rate lower than that of the sulfuric acid using a metering pump 38 in a fixed small amount. The mixture is produced from the sulfuric acid and the hydrogen peroxide in an interflow part 105, and the chemical mixture is supplied to a substrate treating device 1 as is, directly after production. Thus, the chemical mixture can be supplied to the substrate treating device 1 without degradation over time, and variations in the mixing ratio between the sulfuric acid and the hydrogen peroxide can be suppressed when producing the chemical mixture, allowing production of a chemical mixture in which a fixed mixing ratio is maintained.
ADACHI TAKAMASA
TAKAHASHI AKIRA
SHIYOUMORI HIROBUMI
Hiromitsu Imaeda
Umemura Hiroaki