Title:
CHEMICAL POLISHING SOLUTION
Document Type and Number:
Japanese Patent JP3629218
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prepare a chemical polishing solution for aluminum or an alloy thereof which smoothens the surface of aluminum or the alloy thereof by chemical polishing, and can impart sufficient luster to the surface subjected to the chemical polishing without incorporating nitric acid therein.
SOLUTION: Inorganic acid other than nitric acid and a tungsten compound are blended to prepare the chemical polishing solution. As the inorganic acid, sulfuric acid and phosphoric acid are preferably used, and also, copper ions, iron ions, or the like, are preferably blended therein.
Inventors:
Haruo Ohara
Hiroshi Ono
Hiroshi Ono
Application Number:
JP2001084308A
Publication Date:
March 16, 2005
Filing Date:
March 23, 2001
Export Citation:
Assignee:
Mitejima Chemical Co., Ltd.
International Classes:
C23F1/20; C23F3/03; (IPC1-7): C23F1/20; C23F3/03
Domestic Patent References:
| JP2004509219A |
Attorney, Agent or Firm:
Keisei Nishikawa
Atsuo Mori
Atsuo Mori
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