CHEMICALLY AMPLIFIABLE RESIST AND RESIST PATTERN FORMING METHOD

Title:

CHEMICALLY AMPLIFIABLE RESIST AND RESIST PATTERN FORMING METHOD

Document Type and Number:

Japanese Patent JPH05241344

Kind Code:

A

Abstract:

PURPOSE: To form a resist pattern excellent in resolution.

CONSTITUTION: A copolymer having P-O-Si bonds in the principal chain and at least alkyl or aryl groups in the side chain is used as base resin and a chemically amplifiable resist is prepd. with the base resin and an acid generating agent. This resist is used as the upper resist of a two-layered resist, an upper pattern is formed by selective exposure and development and the lower resist is dry-etched with oxygen plasma through the upper pattern as a mask to form a resist pattern.

More Like This:

JP2009116111	PHOTOCURABLE RESIN COMPOSITION, ITS CURED PRODUCT PATTERN, AND PRINTED WIRING BOARD WITH CURED PRODUCT PATTERN
JPH0324102	HIGH SENSITIVITY PHOTO POLYMERIZABLE COMPOSITION CONTAINING HYDROGEN DONATING MERCAPTAN
JP2007505367	On-machine developable IR-sensitive printing plate containing onium salt initiator system

Inventors:

YANO EI
FUKUYAMA SHUNICHI
WATABE KEIJI
NAMIKI TAKAHISA
FUKUDA MANAMI

Application Number:

JP4508092A

Publication Date:

September 21, 1993

Filing Date:

March 03, 1992

Export Citation:

Click for automatic bibliography generation Help

Assignee:

FUJITSU LTD

International Classes:

G03F7/029; G03F7/039; G03F7/075; G03F7/26; H01L21/027; (IPC1-7): G03F7/075; G03F7/029; G03F7/039; G03F7/26; H01L21/027

Attorney, Agent or Firm:

Teiichi

Previous Patent: JPS5241343

Next Patent: HOISTING DRUM