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Title:
CHEMICALLY AMPLIFYING RESIST COMPOSITION
Document Type and Number:
Japanese Patent JP3675133
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To obtain a resist compsn. which shows excellent adhesion strength to a film material and excellent durability against etching and for which a normal developer can be used for development, by incorporating a specified polymer and a PAG (photoacid generator).
SOLUTION: This chemically amplifying resist compsn. contains a polymer expressed by formula and a PAG. In the formula, R1 and R2 are 1 to 10C aliphatic hydrocarbons having hydroxyl groups or carboxyl groups, R3 is a hydrogen atom or methyl group, R4 is a t-butyl group or tetrahydropyranyl group, and m and n are integers satisfying 0.1≤n/(m+n)≤0.5. The amt. of the PAG is 1 to 20wt.% of the weight of the polymer expressed by the formula. Thereby, a developer which is used for a normal developing method can be used to develop the resist compsn., and the obtd. resist had excellent etching resistance and high adhesion strength to a film material.


Inventors:
Yool, Kang
Sang-jun, Choi
Dong-won, Jung
Chun-geun, Park
Young-bum, Koh
Application Number:
JP1997000279070
Publication Date:
July 27, 2005
Filing Date:
October 13, 1997
Export Citation:
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Assignee:
SAMSUNG ELECTRON CO LTD
International Classes:
G03F7/028; C08F220/10; C08F222/06; C08F232/00; C08F232/08; C08K5/03; C08K5/375; C08L33/04; C08L35/00; C08L45/00; G03F7/004; G03F7/039; H01L21/027; (IPC1-7): G03F7/039; C08F220/10; C08F222/06; C08F232/08; C08L33/04; C08L35/00; C08L45/00; G03F7/004; H01L21/027
Domestic Patent References:
JP3545903B2
JP10010739A
JP5080515A
JP5009231A
JP4063810A
JP2146045A
JP1217453A
Foreign References:
US3280080
Attorney, Agent or Firm:
八田 幹雄
野上 敦