新規の重合体及びこれを含有した化学増幅型レジスト

Japanese Patent JP4347179

B2

A chemically amplified resist composition includes a novel polymer, a photoacid generator, and a solvent. The chemically amplified resist can form a resist pattern that is excellent in adhesiveness with a low dependency to the substrate, transparency at the far ultraviolet wavelength range such as KrF Excimer laser or ArF Excimer laser, dry etch resistance, sensitivity, resolution, and developability. In addition, the polymer contains a maximum number of saturated aliphatic rings to enhance etching resistance, and additionally includes an alkoxyalkyl acrylate monomer introduced as a solution to the problem with the conventional polyacrylate resist in regard to edge roughness of the pattern, to form a uniform edge of the pattern because the alkylalcohol compound generated together with a formaldehyde and a carboxylate compound by a deprotection reaction of the alkoxyalkyl acrylate monomer with an acid acts as a solvent or an antifoaming agent in the pattern.

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Lim Yuntech
Park Yu Hyun
Seodongchul
Kim Chang Min
Chosondak
Yu Hyun Sang

JP2004281651A

October 21, 2009

September 28, 2004

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Korea Kumho Petrochemical Co.,Ltd.

C08F212/08; G03F7/033; C08F216/12; C08F220/10; C08F222/06; C08F232/00; C08G61/04; G03C1/76; G03F7/004; G03F7/039; H01L21/027

JP2002327021A

Masayuki Masabayashi
Kazuko Fujita

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