To keep a mounting condition of a circuit substrate with high reliability even in an environment where the temperature swings wildly, and reduce damage due to thermal expansion on joint portions, such as solder of the substrate.
A chip antenna 1 comprises a chip-like substrate 11 and a conductive patterns 12 formed on both surfaces of the substrate 11. The substrate 11 is made of a substrate material of which coefficient of thermal expansion is approximately same as that of a substrate to be mounted thereon. A manufacturing method of the chip antenna 1 includes a step for piercing through holes 15 on a resin substrate 11 with copper foils formed on the both surfaces, a step for plating a conductor on the through holes 15, a step for executing pattern etching to the copper foils so that the copper foil forms a predetermined conductive pattern, and a step for executing scribingto the substrate 11 after the pattern etching for shaping the substrate in a chip form.
| JPH04322504 | PLANE ANTENNA |
| JP2005123852 | ANTENNA MODULE |
| JP4623141 | Planar antenna, communication device, and how to mount the flat antenna |
GO YOSHIOMI
Tadashi Takahashi
Masakazu Aoyama
Akihiko Eguchi
Hideyuki Sugiura
Yasuhiko Murayama
Noriko Yanai
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