Title:
CHIP BOARD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3030699
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a chip board which prevents damage by bacteria or vermins from occurring without the use of a formalin resin adhesive, and a technology to increase productivity and upgrade quality and further stabilize the dimensions of the chip board at an advantageous cost.
SOLUTION: The chip board is formed of chips impregnated and sealed with glyoxal resin and an agent, which and integrally molded through an adhesive of a resin other than formalin resin. A mixture obtained by mixing the glyoxal resin, the agent and the resin adhesive other than the adhesive of a resin other than the formalin resin arbitrarily is applied to the chips, or these components are applied separately to the chips. Further, the coat is heated and dried to seal the chips. The chips thus obtained are integrally molded through the resin adhesive into the chip board.
More Like This:
Inventors:
Masatoshi Ohmura
Application Number:
JP6456698A
Publication Date:
April 10, 2000
Filing Date:
February 26, 1998
Export Citation:
Assignee:
Noda Co., Ltd.
International Classes:
B27K3/50; B27K5/00; B27N1/00; B27N3/02; (IPC1-7): B27N3/02; B27K3/50; B27K5/00; B27N1/00
Domestic Patent References:
| JP59158241A | ||||
| JP9300313A | ||||
| JP929711A | ||||
| JP3253303A |
Attorney, Agent or Firm:
▲桑▼原 史生