Title:
CHIP CARRIER FOR SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JPS5411665
Kind Code:
A
Abstract:
PURPOSE: To reduce the ground inductance, by containing a chip in the hole at the center of the chip carrier, providing the grounding and input conductive layer near the electrode on the carrier upper surface, and providing excellent thermal conductor at the bottom of the hole.
Inventors:
TSUZUKI NAOFUMI
Application Number:
JP7674877A
Publication Date:
January 27, 1979
Filing Date:
June 28, 1977
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L23/12; (IPC1-7): H01L23/12