Title:
CHIP CARRIER WITH CIRCUIT SURFACE COVERED WITH PROTECTIVE COATING
Document Type and Number:
Japanese Patent JP2501287
Kind Code:
B2
Abstract:
PURPOSE: To protect a chip carrier against damage and delamination caused by a standard heat cycle test by a method wherein a first cover is surrounded with a second cover which contains urethane and has an elastic coefficient smaller than a specific value.
CONSTITUTION: The outside of solder balls 60 coated with a cover and a part of or preferably all of a circuit surface 30 except contact pads 40 are covered with a coating 110. The coating 110 protects a covered circuit against hazards caused by a mechanical and a surrounding environment. Coating agent is formed of composite material which has an elastic coefficient of 10,000 psi or below at a temperature of 25°C and is composed of acrylic urethane oligomer, acrylic monomer, and photoinitiator which are compounded right in volume. By this setup, a chip carrier with a protective coating free from damage or delamination caused by a standard heat cycle test can be obtained at a comparatively low cost.
Inventors:
BURENDA DAIAN FUREI
CHAARUZU AANORUDO JOSEFU
FURANSHISU JON ORUSHEFUSUKI
JEEMUZU UOREN UIRUSON
CHAARUZU AANORUDO JOSEFU
FURANSHISU JON ORUSHEFUSUKI
JEEMUZU UOREN UIRUSON
Application Number:
JP13614793A
Publication Date:
May 29, 1996
Filing Date:
June 07, 1993
Export Citation:
Assignee:
INTAANASHONARU BIJINESU MASHIINZU CORP
International Classes:
H01L21/56; H01L21/60; H01L23/12; H01L21/52; H01L23/28; H01L23/29; H01L23/31; H01L23/50; (IPC1-7): H01L23/12; H01L23/02
Domestic Patent References:
| JP529393A | ||||
| JP521523A |
Attorney, Agent or Firm:
Kiyoshi Goda